Compact Modeling and Model Order Reduction

	Nanotech 2001 Vol. 1 Technical Proceedings of the 2001 International Conference on Modeling and Simulation of Microsystems Chapter 3: Compact Modeling and Model Order Reduction
-	New Numerical Techniques and Tools in SUGAR for 3D MEMS Simulation
	Z. Bai, D. Bindel, J. Clark, J. Demmel, K. Pister and N. Zhou
	University of California Davis, U.S.A.
-	Using Scalar Algebraic Multigrid Solvers for Efficient 3-D Stress Analysis of Microfabricated Structures
	S. Mijalkovic
	Delft University of Technology, The Netherlands
-	Using Pseudo Transient Continuation and the Finite Element Method to Solve the Nonlinear Poisson-Boltzmann Equation
	A.I. Shestakov, J.L. Milovich and A. Noy
	Lawrence Livermore National Laboratory, U.S.A.
-	Experimental Determination of Electrical, Metallurgical, and Physical Gate Lengths of Submicron MOSFET’s
	X. Zhou and K.Y. Lim
	Nanyang Technological University, Singapore
-	Compact Modeling of Avalanche Breakdown in pn-Junctions for Computer-Aided ESD Design (CAD for ESD)
	Y. Subramanian and R.B. Darling
	University of Washington, U.S.A.
-	Compact Modeling and Circuit Impact of a Novel Frequency Dependence of Capacitance in RF MOSFETs
	C. Sudhama, K. Joardar, J. Whitfield and A. Zlotnicka
	Motorola SPS, U.S.A.
-	A New Compact Model of Floating Gate Non-Volatile Memory Cells
	L. Larcher, P. Pavan, F. Gattel, L. Albani and A. Marmiroli
	Università di Modena e Reggio Emilia, Italy
-	Antiphase Design for Balanced Oscillators
	X. Liu, Z. Sheng, C.L. Law, C. Qian and Z. Sun
	Nanyang Technological University, Singapore
-	Full Wave Electromagnetic Analysis and Model Order Reduction for Complex Three Dimensional Structures
	I. Balk and Y. He
	IntelliSense Corporation, U.S.A.
-	Table-Based Numerical Macromodeling for MEMS Devices
	J. Wu and L.R. Carley
	Carnegie Mellon University, U.S.A.
-	Scalable Macromodels for Microelectromechanical Systems
	V. Srinivasan, A. Jog and R.B. Fair
	Duke University, U.S.A.
-	Compact Model for the Squeezed-Film Damping Including the Open Border Effects
	T. Veijola, K. Ruokonen and I. Tittonen
	Helsinki University of Technology, Finland
-	A Design Approach for Robustness Improvement of Rate Gyroscopes
	C. Acar and A. Shkel
	University of California Irvine, U.S.A.
-	Boundary Independent Exact Thermal Model for Electronic Systems
	Y.C. Gerstenmaier, H. Pape and G. Wachutka
	Siemens AG, Corporate Technology, Germany
-	Macromodeling Temperature-Dependent Curl in CMOS Micromachined Beams
	S. Iyer, H. Lakdawala, G.K. Fedder and T. Mukherjee
	Carnegie Mellon University, U.S.A.
ISBN:	0-9708275-0-4
Pages:	638
Hardcopy:	$100.00
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